How To Fix No Service On iPhone 6

Introduction
Have you come through ‘no service’ on your iPhone 6? Once your iPhone got cut off, you can not use mobile data, send text messages or make a phone call. You still can connect to the internet by a Wi-Fi network. There are external and internal causes for iPhone ‘no service’ problem, which means no one-size-fits-all solution.

Recommended Tools:
Digital Multimeter

Maintenance Platform

Electron Microscope

Soldering Iron

Hot Air Gun

Stainless Steel BGA Scraper

BGA Paste Flux
Rosin
PCB Holder

BGA Reballing Stencil
Anti-static Wrist Strap

Screw Drivers
LCD Opening Sucker

Tweezers (ESD – 11)
Anti-static Plastic Pry Bar

UV Dryer Lamp


Steps
1. Turn on the phone, searching for the signal – no service. Spread out the dialer board, enter ‘*#06#’ for IMEI code – no results. We can draw the preliminary cause as signal failure.
2. Go to Settings – General – About, IMEI code displays right, SIM card readable, and Modem Firmware functions normally.
3. Disassemble the phone, detach phone battery, take down the LCD screen assembly, then take out the motherboard.
4. Remove the shield plate on motherboard with cutting nipper(Hot air gun is not recommended here because the shield plate is hard to remove and high temperature might cause damage to components nearby). Attach motherboard to PCB holder.
5. Apply some BGA paste flux to the baseband CPU, blow it with hot air gun at 300 degrees centigrade. After a while, take down the baseband CPU.
6. Clean the tins on the bonding pad with soldering iron, then dip some rosin with Goot wick for secondary cleaning. After that, clean it again with PCB cleaner.
7. Roll out the maintenance drawing for reference. Point out the U1 Y1 pin as data signal failure. Test the U1 Y1 pin of the baseband CPU with digital multimeter, no resistance. We can conclude that the pin has been disconnected.
8. Scrape the insulation varnish off the U1 Y1 pin circuit, solder the tins on the circuit with soldering iron for cable welding afterwards. Then align a solder added copper wire with a diameter of 0.02 millimeter to the exposed circuit with soldering iron. Clean it with PCB cleaner.
9. Apply some UV curable solder mask to the aligned copper wire, then put it under the UV dryer lamp for 10 minutes.
10. Apply some rosin with soldering iron for cleaning, PCB cleaner afterwards. Once finished, reball the baseband CPU with BGA reballing stencil.
11. Apply some soldering paste with BGA scraper and smear evenly on the right place. Blow it with hot air gun for formation, take it down and blow it with hot air gun again.
12. Apply some BGA paste flux to the bonding pad, align the CPU to the rightplace, blow it with hot air gun at 280 degrees centigrade.
13. Once the motherboard is cooling enough, clean it with PCB cleaner. Afterwards, install the motherboard to the phone and test – IMEI code functions well.

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